- Characterization of the Microstructure and Reliability of Si/micro Cu Pillar/Solder/Glass
Assemblies
E. Cotts, B. Arfaei
- Nano-Cu Based Alternative to High-Temperature Solders
P. Borgesen
- New Constitutive Relations for Solder in Cycling
C. Greene
- Bismuth-based Solders and Transient Liquid Phase Bonds for High-Temperature Electronics
J. Cho
- Determining Factors Controlling Adhesion of Pulsed Laser Sintered and Nonoink Printed
Traces on Flexible Substrates
C-J Thong, B. Shim, M. Poliks
- Enhance the Cu/EMC Interface Adhesion by Controlling Surface Finish of Cu
P. Mu, G. Zhou
- In-Situ Nano Scale Strain Measurement Using 2D DIC with SEM
SB Park