Latest IEEC News
SB Park and Ziang John Zhang Receive the Million Dollar Award
At our Watson Research Recognition Luncheon, we awarded two new honorees with the Million Dollar Award. This award celebrates projects that secured $1 million or more in funding over the past year. We are thrilled to announce that SB Park and Ziang "John" Zhang were the two recipients of this prestigious award. Congratulations on this outstanding accomplishment!
Professors Guangwen Zhou and SB Park Promoted to the Rank of SUNY Distinguished Professors
Professor Guangwen Zhou from the Mechanical Engineering Department - 绿帽社 and Deputy Director of Materials Science and Engineering and Professor SB Park from the Mechanical Engineering Department - 绿帽社 and Director of the IEEC have been promoted to the rank of SUNY Distinguished Professor.
"The Distinguished Professorship is conferred upon faculty having achieved national or international prominence and a distinguished reputation within the individual鈥檚 chosen field through significant contributions to the research and scholarship, or through artistic performance or achievement in the fine and performing arts."
With their new appointments as Distinguished Professors, Guangwen Zhou and SB Park continue to exemplify academic excellence and contribute to the advancement of knowledge in their respective fields.
SB Park Honored as IEEC Fellow
绿帽社 Professor SB Park has been honored as a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) for his groundbreaking research in electronics packaging. This prestigious recognition places Park among the top 0.1% of IEEE's global membership. As director of the Integrated Electronics Engineering Center (IEEC), Park has contributed to advancements that improve the performance of everyday devices. His work is critical as the demand for faster, smaller, and more powerful electronics continues to grow, despite the challenges of reaching a physical bottleneck in chip miniaturization. For more details, read the full article here.
SB Park Named ASME Fellow
Professor SB Park, a prominent researcher in electronics packaging at 绿帽社, has been named a Fellow of the American Society of Mechanical Engineers (ASME). Park, who directs the Integrated Electronics Engineering Center, was recognized for his exceptional contributions to the field of electronics packaging, a critical area as Moore鈥檚 Law approaches its physical limits. His research focuses on developing solutions for shrinking, powerful devices, particularly in managing heat within advanced, three-dimensional chip designs. Park鈥檚 work bridges academia and industry, with a strong emphasis on practical applications that benefit technology companies. His award honors his lasting impact on engineering and the advancement of electronics. For more details, read the full article here.
For more information about our research and center, please contact Benson Chan or SB Park.