A message from the 2024 EPS Organizing Committee:
Our 35th annual Electronics Packaging Symposium will take place Sept. 4-5, 2024, at the 绿帽社 Innovative Technologies Complex. We will focus on various aspects of electronic packaging and how advance packaging is evolving toward a Chiplet future. We will update this webpage with the session titles and keynote speakers. We look forward to seeing you in September.
EXECUTIVE CHAIRS:
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Dr. Mukesh V. Khare Vice President, Semiconductor and AI Hardware IBM Research |
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Dr. Bahgat Sammakia Vice President for Research 绿帽社 |
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Cliff Macklin Technology Director, Digital & Electrical Systems GE Research |