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Sample preparation lab

• Isomet Precision Saw
• Buehler Vacuum Chamber
• Buehler Ecomet 6 Grinder/Polisher
• NEY Ultrasonic Bath
• Torramet Specimen Dryer
• Wild M3C Stereo Microscope (6.5 to 40X)
• Olympus SZ40 Stereo Microscope (13.3 to 80X)

Optical Microscopy Suite

• Microscopic Lab
• Wild M420 (maximum magnification 80X)
• Nikon Optiphot (maximum magnification 1000X)
• Wild M8 (maximum magnification 125X)
• Unitron Versamet Metallograph (maximum magnification 1200X)
• IMAGING
• Nikon D2X Digital Camera
• Spot Insight Camera
• VIA-150 Video Image Marker Measurement System

Sonix HS500 HiSPEED Acoustic Microscope System

• Non-destructive test uses ultra-sound to characterize samples
• Used to find voids, cracks, delamination, die tilt, etc.
• Scan at a specified depth to collect data at desired interfaces
• Pulse-echo and through scan capabilities
• Create 3-D images, vertical cross-section images
• 10, 15, 50 and 110 MHz transducers available

Fein Focus Series FXS 100.23 Real-Time X-Ray Imaging System

• Used for observing semiconductor bonds, bare board registration of inner layers, populated PWB solder joints, ceramic material flaws, etc.
• Non-contact, non-destructive inspection
• Integrated X-Y-Z manipulation system
• Tilt and rotate control
• Real-time video imaging
• Magnification zoom of 2X up to 180X (depending on the thickness and orientation of the sample)
• Maximum sample size 12"x15"
• Voiding calculation & BGA inspection software

Coordinate Measuring Machine

Tabletop system in a bridge-type design with a removable granite support. M10 threaded, stainless steel inserts accommodate and secure moderately sized workpieces. Fully pneumatic, counterbalanced column enables infinite adjustability for varying probe weights with a built-in braking device.
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• Coordinate Measuring Machine
• Maximum Part Weight: 500 lbs (227 kg)
• Part Size Capability (X, Y, Z): 22 x 29.5 x 19 in
• Operating temperature: 13 °C to 35 °C
• Repeatability* 0.00016 in
• Volumetric Accuracy* 0.0004 in
• Linear Accuracy* 0.0002 in
• Measuring Speed (Max): 30 in/sec *Per ASME B89

Aetrium Model 6000 Bubble Leak Detector

• Used to inspect for leaks in sealed components
• Tank tray dimensions 10" x 4"
• 1.5X Fresnel lens and 3.0X external lens
• Temperature control within ±1 °C
• Meets requirements for MIL SPEC 883C, 750C and 202F

Veeco System XR X-Ray Fluorescence Spectrometer

• Benchtop XRF unit
• Sample stage capacity of approximately 6"x6"
• X-ray spot diameter of 50 µm up to 300 µm
• Analysis of elements from Na to U
• Internal database with K, L, and M fluorescence lines Sampling depth of several µm
• Layer thickness evaluation capability

Dage Series 4000 and 4000+ Bond Testers

• Perform die shear, ball shear, wirebond pull, cold bump pull testing
• Features and capabilities:
• Die shear cartridge to 100 kg
• 5 kg tweezer cartridge for cold bump pull
• 5 kg ball shear load cartridge
• 100 g wire pull load cartridge
• 50 kg push/pull load cell Heated stage
• Data analysis and graphics software

Rheometer/Viscometer

• Enables analysis of visco-elastic materials such as solder paste, epoxy underfills, and conductive adhesives Measured parameters: Viscosity, Complex Viscosity, Kinematic Viscosity, Storage Modulus, Loss Modulus, and Compliance
• Operational modes: oscillation, creep, and flow
• Automatic gap setting with 0.01 µm resolution
• Temperature range Standard (Peltier): -5 to 99 °C Extended (induction heating): -100 to 400 °C
• Maximum torque: 0.05 Nm (500 K dyne cm)

Ocean Optics Spectrum Analysis System

• For optical characterization of light sources, including LEDs and junction laser
• Components
  • USB4000 UV/VIS spectrometer with fiber optic coupling LED
  • variable current power source
  • Integrating sphere
• Capabilities
  • Wavelength range: near IR through UV (850 nm to 200 nm) Optical resolution

FLIR Model E60 Thermal Camera

• For construction of thermal images; essentially a contour map of temperature
• Mid IR (wavelengths of 7-14 m)
• Capabilities
• 7 Hz image capture
• Still image and motion video
• IR and optical imaging combined in either picture-in-picture mode or thermal fusion mode
• Emissivity correction
• Zoom of distant objects down to 2x magnification of close objects
• 240x320 pixel resolution of thermal image Temperature range 20 – 650 C
• Sensitivity < .05 C

Analysis Tech 32-102 Event Detector

• Used for reliability/life testing of electrical connectors. Also applicable to testing of passive interconnects such as surface mount solder joints and chip-to-carrier interconnect systems.
• Analysis Tech 32-102 Event Detector
• 32 channels with simultaneous monitoring
• Channel test current settings 10, 20, 50, 100 ma
• Channel current source tolerance (0-20 Ω load) +4%, -11% Threshold voltage tolerance (pulse duration) ± 5% (typical), ± 10% (maximum)
• Selectable minimum event duration settings 0.1, 0.5, 1.0 µs Data collection via RS232C serial port
• Compatible with HLV amplifiers to provide low level threshold resistance and low current test capabilities

HP 4194A Impedance/Gain-Phase Analyzer

• Provides integration for measurement and analysis or go/no-go testing of components and circuits
• Programmable with customized measurement, computation, and analysis functions
• 11 impedance and 4 gain-phase measurement functions Frequency range 100 Hz to 40 MHz for impedance 10 Hz to 100 MHz for gain-phase
• Output range (adjustable DC bias level of ±40 V) 10 mV to 1 Vrms for impedance -65 dBm to ±15 dBm for gain-phase

SR560 Low-Noise Voltage Preamplifier

• Use in applications for low-temperature measurements, optical detection, and audio engineering
• AC or DC coupled, differential or single-ended inputs
• 4 nV/√Hz input noise @ 1 kHz
• 1 MHz bandwidth •CMRR 100 dB from DC to 1 kHz
• Variable gain from 1 to 50,000
• Selectable gain allocation
• Gain stability 200 ppm/°C
• Frequency response ±0.5 dB to 1 MHz, ±0.3 dB to 300 kHz (gains up to 1000)
• Configurable signal filters (low-pass or high-pass)
• Maximum output 10 Vpp into 50 Ω and 600 Ω

SR-830 Dual-Phase DSP Lock-In Amplifier

• Simultaneously displays both signal magnitude and signal phase
• Frequency range 1 mHz to 102.4 kHz
• Dynamic reserve >100 dB •Stability 5 ppm/°C
• Phase resolution 0.01°
• Time constants from 10 µs to 30 ks (6, 12, 18, and 24 dB/octave rolloff)
• Auto-gain, -phase, -reserve and -offset
• Synthesized reference source (25 ppm frequency accuracy; <-80 dBc distortion)
• Harmonic detection (2F, 3F, ..., nF)
• Standard GPIB and RS-232 interfaces

Interconnect Parameter Analyzer and Time Domain Reflectometer

• Measures high-speed interconnects; extracts and verifies models by overlaying simulated and actual results
• Direct readout of inductance, capacitance, and impedance vs. time
• Fixtures to support various IC packages
• Instrument performance: 35 ps rise time, fully differential, multi-channel TDR
• Enhanced accuracy TDR impedance measurements for results to within 1.5%
• Supports extraction of lumped, distributed, mixed, coupled, and lossy-line models

HP 8720C Vector Network Analyzer

• Simultaneous measurements of active device transmission and reflection characteristics
• Scalar parameter measurements: Gain, Gain Flatness, Gain Compression, Reverse Isolation, Return Loss (SWR) and Gain Drift
• Vector parameter measurements: Deviation from Linear Phase, Group Delay and Complex Impedance
• Fast-sweep source with 1 Hz frequency resolution Frequency range 50 MHz up to 20 GHz
• Power output +10 dBm
• 20 dB range power sweep

WYKO NT 1100 Optical Profilometer

• For applications in MEMS, thick films, optics, ceramics and other advanced materials
• Utilizes white light interferometry
• 3D surface measurements, from sub-nanometer roughness to millimeter- high steps
• Vertical Measurement Range: 0.1nm to 1mm
• Vertical Scan Speed up to 7.2μm/sec (288μin./sec)
• Lateral Spatial Sampling 0.08 to 13.1μm
• Field- of -View: 8.24mm to 0.05mm (larger areas with Data Stitching option)
• Reflectivity: 1% to 100%