Ultra-MIcrotome
The Ultramicrotome Leica EM UC7 provides easy preparation of semi- and ultrathin sections
as well as perfect, smooth surfaces of biological and industrial samples for TEM,
SEM, AFM and LM examination. It can be used for sectioning at room as well as cryo
temperatures
SEM Ion Etching and Coating
Precision Etching and Coating System
Gatan 682 PECS Precision Etching & Coating System makes use of high energy Ar ion:
(1) to get rid of mechanical polish induced damage from the sample surface and (2)
to coat the sample surface with conductive layer with nanometer precision. Thus, this
technique highly effective for SEM sample cleaning or etching followed by high-resolution
sputter coating.
Plasma Cleaning System
Plasma Cleaning System
Gatan Solarus Model 950 uses low power (10-65W) plasma to remove hydrocarbon contamination
of TEM and SEM specimens. As a result, electron beam induced damage can be greatly
reduced. The system is available for most of the SEM and TEM samples
SEM Specimen Ion Mill for Cross Sectioning
Cross-Section Polisher
The JEOL SM-9010 Cross Section Polisher (CP) Clean uses high energy Ar ion beam to
produce mechanical-damage-free cross section of almost any material in simple steps.
The CP can prepare a perfect cross section from almost any material such as; Difficult-to-polish
soft materials such as copper, aluminum, gold, solder, and polymer, Difficult-to-cut
hard materials such as ceramic and glass, and Composites of these materials. The cross
section prepared by the CP is suitable for SEM-EDS, WDS, Auger, and EBSD (Electron
Back Scatter Diffraction) analysis, and for observation and measurement of multi-layered
structures. The JEOL CP allows ~500 碌m (FWHM) Ar ion beam size at 2 - 6 kV acceleration
voltage and accomodates maximum specimen size of 11 mm x 9 mm x 2 mm.
Dual Beam Ion Mill
Dual Beam Ion Mill
Dual Beam Ion Mill uses high energy Ar ion beam on prethinned TEM specimens to reduce
the thickness to electron transparency. It can be used for semiconductor, metals,
and insulator.
Fischione Model 1010
1~6 kV acceleration voltage
Thickness monitor to automatically stop when the desired thickness is achieved
Dry pumping system to prevent sample contamination
Sputter Coater
Sputter Coater
Sputter Coater provides conductive metal coating on non-conducting specimen for SEM
imaging. Turbopumping system allows rapid pumping.
Carbon Coater
Carbon Coater
Carbon Coater provide conductive carbon coating on non-conducting specimen for SEM
imaging. Turbopumping system allows rapid pumping.
Ultrasonic Disk Cutter
The Ultrasonic Disk Cutter is specifically designed to cut out TEM specimen, i.e.,
3 mm diameter disk, from hard and brittle materials without thermal or mechanical
damage. It is capable of producing disk specimen from the materials of which thicknesses
range from 10 mm to a few mm.
DimplING Grinder
Dimpling Grinder
Fischione Model 200 pre-thins TEM specimen with only central area reduced to ~10 mm.
As a result, the produced TEM specimen has large electron transparent area near central
area together with the good structural integrity to be handled by tweezer. It can
be used mostly for metals, semiconductors and insulators.
Multi Prep Polisher
The Multi Prep Polisher system enables precise sample preparation of a wide range
of materials for microscopic evaluation by semi-automatic sample preparation. This
results in consistent polishing results , regardless of the skill level of the user.
The digital dial indicator allow the operator to monitor how much material is being
removed in real time with micrometer precision. Typical application s include the
sample preparation for IC die, electronic package, printed circuit boards, electronic
components and other materials systems
Vibratory Polisher
Vibratory Polisher
Vibratory polisher Vibromet 2 from Buehler can be used for TEM and SEM/EBSD specimen
preparation.
